United States Patent Number 5,328,522
July 12, 1994
Reference*
Solder pastes
Patent Abstract
Solder powders coated with a thin layer of parylene and solder pastes containing
the coated solder powders are disclosed. The coated solder powders can exhibit
a high degree of resistance to oxidation and to reaction with the flux contained
in the solder paste without substantially interfering with the reflow characteristics
of the solder.
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